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Thermal Interface Silicone Ultra Soft Pad

TC-CA Series

The newly developed series of products have both high thermal conductivity and excellent electrical insulation properties, which stem from Shin-Etsu's advanced polymer and thermally conductive filler composite material technologies.

 

Features

High cost performance

High thermal conductivity

Low-hardness that makes for good compressibility and a stress-relaxation property that can reduce stress to heat modules

Excellent workability and processibility

Low specific gravity

Applications

The main application of this new series of silicone soft pad products will be for countermeasures against the heat emanating from various electronics devices,
1. notebook PCs   2. LED lighting   3. hybrid cars and electric cars etc.
It meets demands for thinner and lighter weight device applications.


General Properties

Parameter
TC-CAS-10
TC-CAB-10
TC-CAD-10
TC-CAT-20
Appearance
Dark gray
Pink
Light reddish purple
Gray
Structure
Single layer
Single layer
Single layer
Single layer
Density
g/cm3
1.9
2.2
3.0
3.2
Hardness Asker C
10
10
10
20
Dielectric Breakdown Voltage@1mm
kV
22
22
15
15
Thermal Conductivity*1
W/mEK
1.8
2.3
3.2
4.5
Thermal Resistance*2
℃/W
0.65
0.49
0.43
0.32
Flame Retardancy UL94
V-0
V-0
V-0
V-0
Thickness
mm
0.5 - 10.0
0.5 - 5.0
0.5 - 5.0
0.5 - 5.0
Operating temp. range
℃
-40 - 150
-40 - 150
-40 - 180
-40 - 180
*1 Based on ISO-22007-2
*2 Based on Shin-Etsu method (Thickness: 1 mm)		 (Not specified values)
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