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Test of organic compound adsorption to Si wafer(substrate surface adsorption-thermal desorption method: JACA, No.34)


Measurement method
  • Uncured sheets of sealant (100 mm×100 mm×1 mm) were cured for 7 days at 23°C/50% RH. Polished wafer chips were placed with the sealant sample inside a glass desiccator (approx. 5 liter) such that the wafer did not touch the sealant. They were left in the desiccator for 24 hours. Next, the wafer chips were removed and heated in a purge-and-trap headspace sampler, and the desorbed gases were analyzed using GC-MS.

Measurement results
Total amount of adsorbed organic compounds by calculation(Corresponding value n-C16H34)
(Units: ng/cm2)
 

Pure Sealant

Pure Sealant
S-type

Our conventional Sealant

Reduced LMW Sealant*

Siloxane

0.01 >

0.01 >

1.7

0.34

Other than Siloxane

1.40

0.04

1.8

1.39

Total organic compounds

1.40

0.04

3.5

1.73
* Competitor's product (not specified values)

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